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Electronics-Grade Ultrapure Water (UPW) Equipment for manufacturing semiconductors, microchips, and flat-panel displays.
Detalhes do produto:
| Lugar de origem: | China |
| Marca: | CHONGYANG |
| Certificação: | ISO ,CE |
| Número do modelo: | CY-UP-10000L/H |
Condições de Pagamento e Envio:
| Quantidade de ordem mínima: | 1 |
|---|---|
| Preço: | negotiable |
| Detalhes da embalagem: | De acordo com a norma de exportação |
| Tempo de entrega: | Com 30-40 dias |
| Termos de pagamento: | L/C, T/T |
| Habilidade da fonte: | 100 séries/mês |
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Informação detalhada |
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| Nome do produto: | Planta do RO | Capacidade: | 10000L/H-100000L/H |
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| Material: | 304 de aço inoxidável, 316L UPVC | Membrana ro: | RO dobro, único RO |
| Tanque de água: | Tanque de água crua, tanque de água do RO, tanque de água médio | PR-tratamento: | filtro do Multi-meio, filtro do carbono ativado, emoliente |
| Marca de bomba: | Grundfos, CNP | Material do alojamento do RO: | SS, FRP |
| Resistividade: | 18.2 MΩ·cm | Válvula: | Válvula de borboleta |
Descrição de produto
Detailed Specifications for Electronics-Grade Ultrapure Water (UPW) Equipment
Electronics-grade Ultrapure Water (UPW) equipment is designed to produce water of the highest purity, critical for manufacturing semiconductors, microchips, and flat-panel displays. The system must reliably achieve a resistivity of 18.2 MΩ·cm at 25°C and have extremely low levels of ions, particles, bacteria, and Total Organic Carbon (TOC).
1. Capacity (Flow Rate)
The flow rate of a UPW system is highly customizable based on the fab’s requirements. Systems are typically sized by their hourly or daily production capacity.
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Standard Range:
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Recirculation Flow: 50 m³/h – 200 m³/h (220 – 880 GPM)
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Make-up Flow: 10 m³/h – 100 m³/h (44 – 440 GPM)
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2. Key Specifications
| Parameter | Specification | Purpose / Rationale |
|---|---|---|
| Final Water Quality | ||
| Resistivity | 18.2 MΩ·cm at 25°C | Measures ionic purity. The theoretical maximum. |
| TOC (Total Organic Carbon) | < 1 ppb (μg/L) | Prevents organic contamination on wafers. |
| Particle Count (≥ 0.05 μm) | < 100 / liter | Eliminates defects in nanoscale circuits. |
| Silica (SiO₂) | < 0.1 ppb | Preforms insulating oxide layers. |
| Bacteria | < 0.01 CFU/mL | Prevents biofilms and microbial contamination. |
| System Components | ||
| Pretreatment | Multi-media filters, Carbon filters, Softeners | Removes suspended solids, chlorine, and organics. |
| Primary Purification | Double-Pass RO (Reverse Osmosis) | Removes >99% of dissolved salts and organics. |
| Polishing | EDI (Electrodeionization) | Continuous, chemical-free removal of residual ions. |
| Final Polish | UV Lamp (185nm & 254nm), Polishing Mixed Bed DI | 185nm UV oxidizes organics; final polishing ensures 18.2 MΩ·cm. |
| Distribution | Continuous Recirculation Loop with 0.1 μm Filters | Maintains purity at point of use and prevents bacterial regrowth. |
3. Materials of Construction
The choice of materials is critical to prevent the system itself from becoming a source of contamination.
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Piping & Fittings: PVDF (Polyvinylidene Fluoride) is the industry standard for the high-purity loop. 316L Stainless Steel (Electropolished, Low Carbon) is used for tanks and some pretreatment components.
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Valves: PVDF Diaphragm Valves or PP (Polypropylene) Valves are standard to minimize dead legs and contamination.
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Pumps: Stainless Steel (316L) with high-quality seals.
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Instrumentation: All wetted parts must be compatible (e.g., PVDF, PFA, 316L SS) to avoid leaching.
4. Power Consumption
The power requirement is significant and varies greatly with the system’s capacity. Major power consumers are high-pressure RO pumps and UV lamps.
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Typical Range: 50 kW – 500 kW
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A small system (10 m³/h) may require ~50-100 kW.
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A large system (100 m³/h) can require 300-500 kW or more.
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Summary:
An 18.2 MΩ·cm Ultrapure Water System is a complex, multi-stage purification train. Its specifications—from the high flow rates and extreme water quality parameters to the inert PVDF materials and substantial power needs—are all engineered to meet the uncompromising purity demands of the electronics industry, ensuring high manufacturing yields and product performance.
